-The candidate is responsible for conducting root causing of SMT/Wave soldering process issues, basic device level failure analysis, understanding of fault isolation techniques, familiar with in IPC workmanship and test method stds.
-Also posses good communication skills so as to interface and support various cross functional departments.
-This position requires that you have good communication skills and must be proficient in technical report writing.
-Candidates must have a Bachelor or Master Degree in engineering discipline.
-5+ years of Semiconductor/SMT engineering experience in Failure Analysis, Reliability.
-Familiar Basic FA tools like electrical component verification equipment and Optical Microscopy, SEM/EDX analysis, FTIR, X-Ray, Dye & Pry Test, Cross-sectioning, staining and Semiconductor de-capsulation
-Someone with extensive experience soldering process failure analysis with various die level fault isolation techniques would be a advantage.
-Knowledge in PCB/IC fabrication, IC test and memory testing and a device physics background will be beneficial.
- Must know reliability fail modes in terms of packaging technologies and fail mechanisms with respect to reliability.